JXC Precision Ceramics Co., Ltd tau lees paub cov kws tshaj lij hauv kev cai high-tech ceramic conponent tov teb, xws li BN, B4C, AlN. Peb muab ntau yam kev ua haujlwm siab evaporation nkoj rau plating kev lag luam, BN, B4C, AlN precision ceramic Cheebtsam hauv plating kev lag luam, kev kho mob kev lag luam, electronics, nuclear zog, roj & roj tsim. Txij li thaum nws tsim nyob rau hauv 1999, peb tau ntsib peb theem ntawm kev loj hlob tsis tu ncua, thiab tau tas li ntxiv dag zog rau peb kev koom tes kev tshawb fawb thiab kev loj hlob muaj peev xwm nyob rau hauv lub hauv paus ntawm ruaj khov khoom los muab cov neeg muas zaub nrog ntau tshaj kev tsim qauv thiab cov khoom.
Vim Li Cas Xaiv Peb
Kev paub nplua nuj
Nyob rau hauv lub tshav pob ntawm lub tshuab nqus tsev kub nias thiab sintering kev npaj ntawm boron nitride, boron carbide, aluminium nitride ceramics, peb tau sau cov kev paub ntau lawm thiab txaus siab rau muaj ib pab neeg tseem ceeb uas muaj ntau tus kws tshaj lij kev lag luam thiab cov kws tshaj lij.
Pab neeg zoo heev
Peb lub tuam txhab muaj peev xwm ua tau zoo, suav nrog 2 tus kws tshaj lij engineers, 3 tus kws tshaj lij engineers, thiab tshaj 50 tus neeg ua haujlwm ntawm ntau hom. Peb pab neeg tshawb fawb muaj 3 tus kws tshaj lij thiab 6 tus kws kho mob cov tub ntxhais kawm, uas nws cov kev txawj ntse thiab kev tshawb fawb muaj peev xwm muab lub hauv paus ruaj khov rau peb cov thev naus laus zis tshiab thiab kev tsim khoom.
Peb Patents
Ntxiv mus, peb lub tuam txhab tam sim no tuav 4 patents ntsig txog boron nitride, boron carbide thiab txhuas nitride ceramic cov ntaub ntawv. Cov patents no tsis tsuas yog ua kom pom peb cov kev txawj ntse hauv daim teb no xwb tab sis kuj muab lub hauv paus ruaj khov rau peb kom tsis tu ncua tso tawm cov khoom tshiab thiab ua tau raws li cov neeg siv khoom xav tau.
Khoom siv Advanced
Peb lub rooj cob qhia ntau lawm tsis yog tsuas yog khav theeb cov cuab yeej tsim khoom thiab cov txheej txheem tshuaj xyuas meej, tab sis tseem hais txog kev huv thiab kev ua kom zoo ntawm qhov chaw ua haujlwm thiab kev ua haujlwm ntawm lean tswj.
H-BN muaj cov txheej txheem txheej zoo ib yam li graphite, qhia cov hluav taws xob rwb thaiv tsev zoo, thermal conductivity, thiab tshuaj lom neeg ruaj khov, thiab tuaj yeem tswj cov khoom ntawm qhov kub thiab txias.
Boasting zoo thermal conductivity thiab qis thermal expansion coefficient, AlN yog cov khoom zoo heev rau thermal poob siab.
Nws yog ib qho ntawm peb cov ntaub ntawv nyuaj tshaj plaws uas paub (qhov ob yog diamo.
Titanium diboride (TiB₂), raws li cov khoom siv ua haujlwm siab, muaj nyob hauv cov hmoov grey lossis grey-dub nrog cov qauv siv lead ua hexagonal. Nws boasts lub melting point ntawm 2900 degree, hardness (HV) ntawm 34GPa, thiab ib tug ceev ntawm 4.52.
Aluminium Nitride (AlN) yog ib qho atomic crystal teej tug mus rau pob zeb diamond zoo li nitrides, uas tuaj yeem tswj kev ruaj ntseg mus txog 2200 degree. Nws nthuav tawm lub zog siab ntawm chav tsev kub, thiab nws lub zog txo qis qis nrog qhov nce hauv qhov kub thiab txias. Boasting zoo thermal conductivity thiab qis thermal expansion coefficient, AlN yog cov khoom zoo heev rau thermal poob siab. Nws muaj zog tiv thaiv molten hlau yaig ua rau nws yog ib qho zoo tagnrho crucible khoom rau melting thiab casting ntshiab hlau, txhuas, los yog txhuas alloys. Tsis tas li ntawd, AlN yog ib qho hluav taws xob insulator nrog cov khoom zoo dielectric, uas qhia tau tias muaj peev xwm siv tau los ua cov khoom siv hluav taws xob. Ib qho AlN txheej rau ntawm qhov chaw gallium arsenide tuaj yeem tiv thaiv nws los ntawm ion implantation thaum lub sij hawm annealing.
Cov txiaj ntsig ntawm Aluminium Nitride Hmoov
High thermal conductivity
Ua cov cua sov kom zoo los ntawm cov khoom siv hluav taws xob tam sim no lossis cov khoom siv hluav taws xob muaj zog los tiv thaiv lawv los ntawm overheating thiab txhim kho lub neej thiab kev cia siab ntawm tag nrho cov khoom siv hluav taws xob yog qhov tseem ceeb tshaj plaws.
Hluav taws xob rwb thaiv tsev
Cov khoom siv hluav taws xob zoo heev ntawm alumina Circuit Court boards yog siv thaum cov khoom siv hluav taws xob muaj hluav taws xob sib xyaw ua ke hauv pcb nrog qhov kev ncua deb ntawm ib leeg. Qhov kev sib cais yog zoo dua li fr4 lossis lwm yam khoom siv silicon.
Thermal expansion stability
Lub thermal coefficient yog tsawg thiab cov cuab yeej yog nthuav tawm tsawg dua nyob rau hauv thermal stress rau txhuas nitride hmoov. Qhov no tuaj yeem siv nrog silicon thiab ua rau lwm yam khoom siv semiconductor ua tau raws li qhov zoo tagnrho.
Durability
Lub zog muaj zog ntawm aluminium nitride hmoov muab cov neeg kho tshuab thiab tshuaj lom neeg ruaj khov kom ntseeg tau lub neej ntev ntawm cov khoom lag luam thiab kev ntseeg siab hauv tsheb, aerospace, lossis chaw kho mob.
Tsis muaj tshuaj lom
Qhov tsis muaj tshuaj lom ntawm cov hmoov txhuas nitride pab hauv kev tsim khoom thiab tuav tau yooj yim.
Hom ntawm Aluminium Nitride Hmoov
Direct Bond Copper Txhuas Nitride PCB
Copper Film los yog tooj liab txheej yog ncaj qha sib txuas rau Aluminium Nitride ceramic substrate siv lub qhov cub kub. Qhov no tooj liab txheej yog sandwiched nrog lub substrate nrog ib tug dielectric insulator nyob rau hauv nruab nrab ntawm lawv. Cov txheej tooj liab yog etched nyob rau hauv cov theem tom ntej los tsim hluav taws xob circuits.
Thick Film Aluminium Nitride PCB
Yog tias Aluminium Nitride substrate yog coated nrog Thick conductive cov ntaub ntawv xws li nyiaj (Ag) los yog kub (Au) los ua ib tug conductive txheej. Cov txheej no yog etched tab sis tsuas yog siv tau rau kev siv hluav taws xob qis lossis nruab nrab ntawm cov ntawv thov tam sim no.
Cov khoom siv substrate thiab cov khoom ntim
Nrog rau kev loj hlob ntawm microelectronics thiab semiconductor technology, tam sim no-fais fab semiconductor li yuav tsum muaj high voltage, siab tam sim no, siab zog ceev, me me, thiab lwm yam ntxwv tib lub sij hawm. Cov cua kub khiav ceev ntawm cov hluav taws xob substrates tau nce ntau, thiab kev tswj xyuas qhov chaw ua haujlwm ruaj khov hauv cov cuab yeej siv tau ua kom pom tseeb.
Electrostatic chuck rau wafer ua
Cov txheej txheem wafer ua nyob rau hauv niaj hnub semiconductor manufacturing txheej txheem muaj ntau yam txheej txheem. Cov wafers yuav tsum tau xa rov qab los ntawm ntau pua cov khoom siv, yog li xav tau ib qho cuab yeej los clamp cov wafers. Electrostatic chuck tuaj yeem kho lub wafer los ntawm electrostatic adsorption. Lub zog adsorption yog uniform thiab ruaj khov. Lub wafer yuav tsis warp thiab deform, kom ntseeg tau qhov tseeb thiab huv ntawm lub wafer. Lub tshuab electrostatic chuck tam sim no tsuas yog siv alumina ceramics lossis aluminium nitride ceramics ua cov khoom tseem ceeb. Rau kev ua haujlwm zoo tib yam silicon wafer, high-purity alumina lossis sapphire tuaj yeem ua tau raws li qhov yuav tsum tau ua.
Cov khoom siv substrate
AlN crystal yog ib qho zoo tagnrho substrate rau GaN, AlGaN, thiab AlN epitaxial cov ntaub ntawv. Piv nrog sapphire los yog SiC substrates, AlN thiab GaN muaj ntau dua thermal txuam thiab tshuaj lom neeg sib raug zoo, thiab tsis tshua muaj kev ntxhov siab ntawm substrate thiab epitaxial txheej. Yog li ntawd, thaum AlN siv lead ua yog siv los ua GaN epitaxial substrate, nws tuaj yeem txo qhov tsis xws luag hauv cov cuab yeej, txhim kho kev ua haujlwm ntawm cov cuab yeej, thiab muaj cov ntawv thov zoo hauv kev npaj cov kub kub, siab zaus, thiab siab. - cov khoom siv hluav taws xob muaj zog. Tsis tas li ntawd, siv AlN siv lead ua raws li AlGaN epitaxial cov ntaub ntawv substrate nrog lub siab txhuas (Al) tivthaiv tuaj yeem txo qhov tsis xws luag hauv txheej txheej nitride epitaxial thiab txhim kho kev ua tau zoo thiab kev pabcuam lub neej ntawm nitride semiconductor li. Lub hnub ci qhov muag tsis pom kev zoo tshaj plaws raws li AlGaN tau ua tiav siv.
Cov ntaub ntawv nyias nyias
Vim AlN qhov dav band sib txawv, muaj zog polarization, thiab bandgap dav ntawm 6.2eV, aluminium nitride nyias zaj duab xis cov ntaub ntawv npaj los ntawm nws muaj ntau yam zoo heev lub cev thiab tshuaj, xws li siab tawg teb zog, siab thermal conductivity, siab resistivity, thiab siab. Vim nws cov tshuaj lom neeg thiab thermal stability, nrog rau cov khoom siv kho qhov muag zoo thiab cov khoom siv kho qhov muag, nws tau dav siv los ua ib qho kev sib cais nruab nrab thiab cov khoom siv insulating hauv ntim cov khoom siv hluav taws xob thiab kev sib xyaw ua ke. Qhov zoo tshaj plaws AlN zaj duab xis kuj muaj cov yam ntxwv ntawm kev sib kis tau ceev heev ultrasonic, me me acoustic yoj poob, ntau piezoelectric coupling tas li, thiab thermal expansion coefficient zoo ib yam li Si thiab GaAs.
Cov khoom ntawm Aluminium Nitride Hmoov
Thermal conductivity
Qhov zoo kawg thermal conductivity ntawm 120 txog 200W / mK. Cov cuab yeej no ntawm Aluminium Nitride PCB pab nrog kev tswj xyuas thermal hauv kev siv xws li RF / Microwave lossis high-power switching devices.
Thermal Expansion
Lub thermal expansion yog tsawg thaum piv rau cov khoom siv silicon zoo sib xws. Lub coefficient ntawm thermal expansion yog CTE< 4ppm/C which reduces the failure of components as the dielectric strength is also higher.
Hluav taws xob rwb thaiv tsev
Ceramic los ntawm xwm muaj cov khoom siv rwb thaiv tsev zoo heev uas ua kom tsis muaj hluav taws xob tawm thiab cais cov khoom siv hluav taws xob nrog 10^12 txog 10^13 ohms centimeter. Qhov no kuj ua kom cov teeb liab kev ncaj ncees nyob rau hauv high voltage thiab high tam sim no daim ntaub ntawv.
Dielectric Properties
Lub dielectric qhov tsis tu ncua yog qhov tsawg thiab thaj tsam ntawm 8.5 txog 10 thiab nws qhov tsis tshua muaj dielectric poob yog qhov zoo dua rau kev tsim cov ntawv siv hluav taws xob ntau zaus thiab kev kub ceev.
Kub Resistance
The operating temperatures can be as high as>350 degrees Celsius. Lub melting point ntawm Alumina Circuit Court board yog tshaj 2000 degrees Celsius raws li nws kuj tswj cov txheej txheem stability ntawm kub dua.

Yuav Ua Li Cas Xaiv Aluminium Nitride Powder
Cov teebmeem thermal expansion
Thaum txuas cov tuag loj lossis cov khoom siv rau txhuas nitride hmoov, xav txog cov yam ntxwv thermal expansion ntawm ob qho tib si pcb thiab cov khoom. Cov thermal expansion coefficient tsis sib haum tuaj yeem ua rau muaj kev ntxhov siab thiab teeb meem kev ntseeg siab.
Thermal vias
Txhim khu kev tswj thermal los ntawm kev tso cov thermal vias hauv qab cov khoom siv kub. Cov vias no pab dissipate tshav kub zoo los ntawm pcb.
Cov dav hlau hauv av
Cov dav hlau hauv av tuaj yeem txhim kho kev ua haujlwm siab zaus los ntawm kev txo cov teeb liab cuam tshuam thiab txhim kho cov teeb liab kev ncaj ncees. Siv cov dav hlau hauv av thaum tsim nyog, tshwj xeeb tshaj yog nyob rau hauv rf thiab microwave daim ntawv thov.
Khoom coj cwj pwm thiab txheej txheem
Nkag siab tus cwj pwm ntawm cov khoom siv thaum lub sij hawm fabrication txheej txheem thiab cov txheej txheem sib dhos. Qhov kev paub no yog qhov tseem ceeb rau kev ua kom ntseeg tau thiab kev ua haujlwm ntawm aluminium nitride hmoov.
Kev txiav txim siab ntau zaus
Ua tib zoo saib xyuas tshwj xeeb rau high-frequency signal routing, impedance tswj, thiab txo cov teeb liab poob. Aluminium nitride hmoov zoo tshaj plaws nyob rau hauv high-frequency daim ntaub ntawv, yog li optimize lub layout raws li.
Kev tswj cua sov
Aluminium nitride hmoov yog paub rau lawv superior thermal conductivity. Siv cov cuab yeej no los ntawm kev tsim cov txheej txheem ua kom sov kom zoo, tshwj xeeb tshaj yog nyob rau hauv cov ntawv thov nrog cov khoom siv hluav taws xob siab.
Substrate Manufacturing
AlN hmoov yog tsim rau hauv ib lub billet los ntawm txias isostatic nias (CIP). Cov txheej txheem no cuam tshuam cov aln hmoov rau hauv lub ntom nti, cov ntaub ntawv cylindricing nyob rau hauv lub sij hawm alnining .Qhov cov nyiaj txiag yog sintered ntawm qhov kub siab tshaj 1800 degree hauv nitrogen huab cua. Sintering fuses lub aln hmoov ua ke, tsim kom muaj cov khoom siv thermal tag nrho, ua kom tuab rau cov xim tuab, ua kom muaj kev ua kom du thiab tsis zoo rau kev ua tiav.
Metallization
Cov yeeb yaj kiab tuab uas muaj cov ntaub ntawv zoo li tungsten lossis molybdenum yog cov tshuaj ntsuam luam tawm mus rau AlN substrate los tsim cov kab hluav taws xob. Cov ntaub ntawv tuab tuab no paub txog lawv cov kav ntev thiab muaj peev xwm tiv taus qhov kub thiab txias.Thin zaj duab xis hlau xws li tooj liab lossis kub kuj tuaj yeem muab tso rau hauv substrate siv cov tswv yim xws li sputtering lossis plating.High-temperature firing yog siv los khi cov metallization rau lub AlN substrate, kom ntseeg tau tias muaj kev sib txuas hluav taws xob.
Multilayer Buildup
Rau cov PCBs nyuaj, ntau yam AlN substrates (ob-sided boards) tuaj yeem ua ke thiab laminated ua ke siv cov nplaum nplaum. Qhov no tso cai rau cov creation ntawm multilayer PCBs.Vias thiab los ntawm lub qhov yog laser-drilled los ntawm stacked khaubncaws sab nraud povtseg thiab ntim nrog conductive pastes, tsim hluav taws xob kev sib txuas ntawm cov khaubncaws sab nraud povtseg.Ib txhia rooj plaub, qhov muag tsis pom thiab faus vias yuav siv tau los mus txuas puab txheej, muab ntxiv routing xaiv.
Kev sib koom ua vaj tsev
AlN substrates yog qhov zoo rau kev sib txuas ncaj qha rau hauv cov pob khoom hermetic, qhov twg cov khoom siv hluav taws xob raug kaw rau kev tiv thaiv.Sealants zoo li epoxy, cov khoom siv brazing, los yog iav tuaj yeem siv los tsim cov ntsaws ruaj ruaj hermetic, ua kom muaj kev ncaj ncees ntawm cov khoom siv hluav taws xob.
Peb lub Hoobkas




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FAQ
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